An Integrated Crack-opening Method for Determining the Work of Fracture of Bonded Polymer Interfaces

نویسندگان

  • Hayden Taylor
  • Duane Boning
چکیده

We describe a non-destructive and inexpensive way of measuring the interface toughness between polymeric layers in microfabricated devices. A flat surface is bonded under pressure to a surface patterned with microscopic steps. When the pressure is removed, cracks develop at the interface as the material peels away from the steps. The toughness of the bond can be inferred from the crack lengths. If the step height is ~1 μm, the cracks are shorter than a millimeter for typical bond toughnesses. Therefore if the substrate is arrayed with recesses, the spatial uniformity of the interface toughness can be assessed.

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تاریخ انتشار 2008